With the rapid development of technology, the requirements for thermal management in high-performance equipment are increasing. In this context, diamond micro powder, with its excellent thermal conductivity, high hardness, and chemical stability, has shown great potential for applications in the field of thermal management. This article will introduce the application of diamond micro powder in thermal management.
Heat sink materials made from diamond micro powder have significant advantages in the field of thermal management. The main function of a heat sink is to absorb and conduct heat to prevent equipment from overheating. Due to its high thermal conductivity (much higher than traditional metals like copper and aluminum), diamond micro powder is an ideal material for making efficient heat sinks.
Application Scenarios: Diamond micro powder heat sink materials are widely used in high heat dissipation demand scenarios such as LED lights, power devices, microwave devices, and high integration electronic devices.
Preparation Process
Material Selection: First, select high-quality diamond micro powder with particle sizes usually ranging from a few micrometers to tens of micrometers.
Mixing: Mix the diamond micro powder with a binder (such as resin or metal) to form a mixture with a certain flowability.
Shaping: Inject the mixture into a mold and shape it using pressure or vacuum adsorption.
Curing: Cure the binder at a certain temperature and pressure to fix the diamond micro powder in place.
Processing: Mechanically process the cured material, such as cutting and grinding, to achieve the required shape and size.
Post-treatment: May include steps like heat treatment and coating to improve the mechanical strength and thermal conductivity of the material.
Key Technologies
Dispersion Technology: Ensuring uniform dispersion of diamond micro powder in the binder is key, usually requiring special dispersants and stirring techniques.
Curing Process: The control of curing temperature and time has a significant impact on the final product's performance.
Advantages: Compared to traditional metal heat sinks, diamond micro powder heat sinks have higher thermal conductivity, better thermal stability, and good insulation properties.
Thermal paste is a thermal management material used to fill the microscopic gaps between heat sources and heat sinks. Adding diamond micro powder to thermal paste can significantly improve the thermal conductivity of the paste, thereby enhancing the heat dissipation effect.
Application Scenarios: Diamond micro powder thermal paste is widely used for the heat dissipation of high-performance electronic components such as CPUs, GPUs, and memory sticks.
Preparation Process
Material Selection: Choose appropriate diamond micro powder particle size and base grease (such as silicone oil or mineral oil).
Mixing: Mix diamond micro powder with grease using a high-speed mixer or grinder to ensure even dispersion.
Stability Testing: Test the stability and thermal conductivity of the mixture and adjust the formula if necessary.
Filling: Fill the mixed thermal paste into packaging containers like tubes or cans.
Key Technologies
Even Dispersion: Ensure the diamond micro powder is evenly dispersed in the grease to avoid sedimentation.
Thermal Conductivity Optimization: Optimize the thermal conductivity of the thermal paste by adjusting the amount and particle size of the diamond micro powder added.
Advantages: Compared to traditional thermal paste, diamond micro powder thermal paste has higher thermal conductivity, better durability, as well as good wettability and fluidity.
Diamond micro powder thermal films are a new type of thermal management material that combines the high thermal conductivity of diamond micro powder with the flexibility of films. These thermal films can closely adhere to the surfaces of flexible electronic products, providing efficient and convenient heat dissipation solutions.
Application Scenarios: Diamond micro powder thermal films are suitable for flexible electronic products such as smartphones, tablets, and wearable devices.
Preparation Process
Material Selection: Choose high-quality diamond micro powder and substrate materials suitable for making thermal films (such as polyimide or polyester).
Coating: Mix diamond micro powder with a binder and coat it onto the substrate using coating technology.
Curing: Cure the binder at a certain temperature and pressure to form a solid thermal film.
Cutting: Cut the cured thermal film into required sizes and shapes.
Performance Testing: Test the thermal conductivity and flexibility of the thermal film.
Key Technologies
Uniform Coating: Ensure the diamond micro powder coating is uniform without missing spots or accumulation.
Curing Process: Control the temperature and time during curing to ensure the performance and reliability of the thermal film.
Advantages: Compared to traditional thermal films, diamond micro powder thermal films have higher thermal conductivity and better flexibility, as well as good corrosion resistance and oxidation resistance.
Through these three applications, diamond micro powder has shown its unique advantages in the field of thermal management, providing innovative solutions for the heat dissipation problems of electronic products. With continuous technological advancements, the application of diamond micro powder in thermal management will become more widespread.
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