Mono-crystal Diamond Technology to Be Applied in Chemical Mechanical Polishing for the First Time

With the rapid development of semiconductor technology, chemical mechanical polishing (CMP), as a core process in integrated circuit manufacturing, shoulders the key task of wafer surface planarization. With technological advancements, mono-crystal diamond is gradually becoming the new favorite in CMP processes due to its excellent performance.

The Superiority of Mono-crystal Diamond Helps Enhance CMP Processes

Mono-crystal diamond exhibits characteristics far superior to polycrystalline diamond in terms of mechanical strength and chemical inertness. As an emerging polishing material, mono-crystal diamond, supported by laser cutting technology, can create more uniform and delicate microscopic structures. These characteristics make mono-crystal diamond perform more stably inCMP processes, especially in high-precision and high-durability application scenarios, providing significant advantages.

Compared to traditional polycrystalline diamond consumables, mono-crystal diamond plates have longer service life and more stable grinding capability. During prolonged polishing processes, mono-crystal diamond can more effectively maintain cutting force, thereby improving overall precision and efficiency of theCMP process. This feature makes mono-crystal diamond an ideal choice for futureCMP consumables, especially given the increasing demand for high-quality surface treatment in complex semiconductor manufacturing processes.

Laser Cutting Promotes Mono-crystal Diamond Applications in CMP Processes

The new generation of mono-crystal diamond plates recently launched by E-Grind, marks the first application of this technology in theCMP process field. This new product relies on precision laser cutting technology to achieve the ultimate pyramid tip structure, significantly enhancing durability and wear resistance. Mono-crystal diamond laser cutting technology focuses on the precise control of each diamond tip's height, angle, and spacing, allowing it to provide more stable cutting force during polishing.

This groundbreaking mono-crystal diamond technology not only ensures high precision but also offers more stable and efficient processing performance forCMP processes. Through this technology, the structure of each diamond plate can be customized according to specific needs, allowing it to adapt to various process requirements and providing semiconductor manufacturers with more diverse solutions.

The Market Prospects for Mono-crystal Diamond Plates are Broad

Currently, mono-crystal diamond plates have been trialed by multiple semiconductor manufacturers, showing excellent performance in polishing precision and stability, and have received initial positive feedback. This product exhibits outstanding performance in key indicators such as the uniformity of tip height, angle, and spacing, significantly enhancing the efficiency and quality of CMP processes. It is expected to be further promoted in the global market in the future.

With the continuous upgrade of the global semiconductor industry, the application of mono-crystal diamond technology will bring significant process optimization and production efficiency improvement to the industry. E-Grind new generation mono-crystal diamond plates not only meet the current semiconductor industry's demand for higher precision polishing but also provide strong support for future technological breakthroughs.