Henan E-Grind Abrasives Co., Ltd.
Henan E-Grind Abrasives Co., Ltd.

Polycrystalline Micron Diamond: The Rise and Application Exploration of a New Force in Heat Dissipat

With the rapid development of technology, the performance of electronic devices is continuously improving, and power consumption is also increasing. How to achieve efficient heat dissipation in a limited space has become a key factor restricting the performance of electronic devices. Against this backdrop, a new type of heat dissipation material—polycrystalline micron diamond, is gradually emerging as a rising star in the field of heat dissipation. This article will unveil the rise and applications of polycrystalline micron diamond.


Overview of Polycrystalline Micron Diamond


As the name suggests, polycrystalline micron diamond is a material composed of many tiny diamond crystals. It retains the advantages of diamond's high thermal conductivity, high strength, and good chemical stability, while overcoming the high cost and processing difficulties of single-crystal diamond.


Advantages of Polycrystalline Micron Diamond in Heat Dissipation


High Thermal Conductivity


The thermal conductivity of polycrystalline micron diamond is far higher than that of traditional heat dissipation materials, such as copper and aluminum. This gives polycrystalline micron diamond a significant advantage in the field of heat dissipation.


Good Mechanical Properties


Polycrystalline micron diamond has high hardness and wear resistance, making it suitable for heat dissipation needs in harsh environments.


Chemical Stability


Polycrystalline micron diamond has excellent chemical stability, making it less likely to react with other substances and suitable for various environments.


Easy to Process


Polycrystalline micron diamond can be processed into different shapes and sizes through cutting, grinding, and other techniques to meet different heat dissipation needs.


Practical Application Cases of Polycrystalline Micron Diamond


Application of Diamond Heat Sinks in Semiconductor Lasers


Diamond heat sinks are used in semiconductor lasers to significantly enhance heat dissipation efficiency. For example, high-quality CVD diamond heat sinks prepared using advanced MPCVD technology achieve about a 25°C cooling effect in semiconductor lasers and increase power by 15%. Additionally, the use of diamond heat sinks in IGBT modules significantly reduces thermal resistance, extending the module's lifespan by 30%.


Heat Dissipation Applications of Diamond Materials in 5G Communication


In the 5G communication field, diamond heat sinks provide excellent heat dissipation for high-frequency, high-power RF devices, enhancing system reliability. Moreover, diamond materials are also applied in the field of new energy vehicles, reducing thermal runaway incidents, extending battery life, and improving safety.


Application of Diamond Materials in High-Power Devices


Known as the fourth-generation heat dissipation material, diamond materials play a crucial role in dissipating heat for high-power electronic devices, semiconductor chips, and other key components. For example, compound electrical uses microwave plasma chemical vapor deposition (MPCVD) to prepare large-size, high-quality diamond films, applied as heat sink materials in semiconductor lasers. By using a magnetron sputtering system to deposit metal layers on the surface of CVD diamond heat sinks, heat dissipation efficiency is significantly improved.


These cases demonstrate the wide application and significant effects of polycrystalline micron diamond materials in the field of heat dissipation. With the further development of technology, the application of polycrystalline micron diamond materials in the field of heat dissipation will become more widespread.


With continuous technological progress and in-depth research, polycrystalline micron diamond will undoubtedly become an important branch of future materials science, bringing more innovation and changes to our lives and work. At the same time, we also need to focus on and address the challenges it faces during development to achieve its widespread application in various fields.

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